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Complete User Guide148 pages · 10 chapters · Updated 2026-09-18
Getting Started Handbook139 pages · 8 chapters · Updated 2026-09-18
Training & Exercise Manual386 pages · 115 chapters · all 104 exercises · Updated 2026-09-18
Complete Theory Manual255 pages · 56 chapters · Updated 2026-09-18
Models & Workflow Manual85 pages · 9 chapters · Updated 2026-09-18

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05.4.1 / Thermal

Heterogeneous 1D transient heat

Solve the laminate temperature history first using effective through-thickness ply properties, user-selected nodes per ply, independent surface schedules, and optional cure or crystallization heat. Expand any equation for its physical meaning, variables, units, model connection, and theory source.

Continuum energy balance

Eq. 05.4.1-01Heterogeneous transient heat equation
ρ(z)cp(z) ∂T/∂t = ∂/∂z [kz(z) ∂T/∂z] + qc + qx
Equation detailsExplanation · variables · model connection · reference

Balances local sensible-energy storage with through-thickness conduction and volumetric heat released by thermoset cure and thermoplastic crystallization. Material coefficients may change abruptly at ply interfaces.

Variablesρ(z)effective ply density at through-thickness coordinate zkg/m³cp(z)effective specific heat capacityJ/(kg·K)T(z,t)temperature fieldKkz(z)effective through-thickness thermal conductivityW/(m·K)qc, qxcure and crystallization volumetric heat sourcesW/m³z, tthrough-thickness coordinate and process timem, s

Model connectionThe micromechanics stage supplies ρ, cp, and k3 for every ply; the material kinetics pages supply qc and qx. The resulting T(z,t) feeds thermal strain and temperature-dependent diffusion.

Theory basisNASA composite cure-process heat model

Cell-centered finite-volume form

Every active ply is divided into a user-selected number of cell-centered control volumes. Each cell belongs to exactly one physical ply, so its storage and conductivity are taken from that ply. Flux continuity is enforced at every shared face.

Eq. 05.4.1-02Areal heat capacity of a transport cell
Ci = ρicp,iΔzi
Equation detailsExplanation · variables · model connection · reference

Collapses volumetric heat capacity across the thickness of one unit-area finite volume, producing the storage coefficient used in the semidiscrete equations.

VariablesCiareal heat capacity of cell iJ/(m²·K)ρieffective density assigned to cell ikg/m³cp,ieffective specific heat assigned to cell iJ/(kg·K)Δzicell thicknessm

Model connectionForms the diagonal capacity matrix C used by the theta time integrator. Refining nodes per ply reduces Δzi while conserving total areal heat capacity.

Theory basisConservative finite-volume heat discretization

Eq. 05.4.1-03Harmonic face conductance
Gi+1/2 = [Δzi/(2ki) + Δzi+1/(2ki+1)]−1
Equation detailsExplanation · variables · model connection · reference

Adds the two half-cell thermal resistances in series. This is essential when adjacent plies have different conductivities because an arithmetic average does not preserve the correct interface heat flux.

VariablesGi+1/2conductance per unit area across the shared faceW/(m²·K)ki, ki+1through-thickness conductivity in the adjacent cellsW/(m·K)Δzi, Δzi+1thicknesses of the adjacent cellsm

Model connectionPopulates the tridiagonal conduction operator. The same resistance construction is reused for the heterogeneous moisture-diffusion operator.

Theory basisFinite-volume interface-flux treatment

Eq. 05.4.1-04Semidiscrete cell energy balance
CidTi/dt = Gi+1/2(Ti+1−Ti) − Gi−1/2(Ti−Ti−1) + qiΔzi
Equation detailsExplanation · variables · model connection · reference

States that heat stored in a cell equals net conductive inflow plus the local volumetric reaction source integrated through the cell thickness.

VariablesTicell-center temperatureKCicell areal heat capacityJ/(m²·K)Gi±1/2left and right face conductancesW/(m²·K)qicombined local volumetric cure/crystallization heatW/m³Δzicell thicknessm

Model connectionAssembled for every transport cell into C dT/dt + K T = Q before application of surface boundary terms.

Theory basisConservative cell energy balance

Independent top and bottom boundary histories

Top and bottom use separate seven-column tables. Continuous temperature, moisture, and coefficient/flux fields are linearly interpolated to the transport time grid; integer boundary IDs are held piecewise constant. A five-row schedule can therefore drive a thousand-step solve without changing the intended boundary mode between schedule breakpoints.

Eq. 05.4.1-05Schedule interpolation and boundary-ID hold
y(t) = yr + (yr+1−yr)(t−tr)/(tr+1−tr)b(t) = br,   tr ≤ t < tr+1
Equation detailsExplanation · variables · model connection · reference

Linearly interpolates continuous boundary data while selecting the last declared discrete boundary type until the next table time is reached.

Variablesy(t)interpolated continuous surface valuefield-dependentyr, yr+1values in adjacent boundary-table rowsfield-dependenttr, tr+1adjacent schedule timessb(t)discrete boundary-condition IDinteger ID

Model connectionApplied separately to both surfaces. Temperature, moisture, and coefficients/fluxes use y(t); thermal and moisture type columns use b(t).

Theory basisProcess-cycle boundary-history context

Eq. 05.4.1-06Thermal surface boundary operators
Prescribed: Gs = 2k/Δz,   Ss = GsTsAdiabatic: Gs = 0,   Ss = 0Convection: Gs = [Δz/(2k)+1/h]−1,   Ss = GsTsCustom inward flux: Gs = 0,   Ss = qin
Equation detailsExplanation · variables · model connection · reference

Expresses prescribed temperature, adiabatic, convection, and custom inward heat-flux conditions in the same linear source form used by the finite-volume matrix.

VariablesGseffective surface conductanceW/(m²·K)Sssurface source added to the cell balanceW/m²Tsscheduled surface or ambient temperatureKhconvective heat-transfer coefficientW/(m²·K)qinuser-defined signed inward heat fluxW/m²k, Δzsurface-cell conductivity and thicknessW/(m·K), m

Model connectionThe selected pair (Gs,Ss) modifies only the first or last transport equation. Top and bottom types, temperatures, and coefficients remain independent.

Theory basisFinite-volume Dirichlet, Neumann, and Robin boundaries

ColumnSurface-table fieldInterpolation
1–3Time, surface temperature, surface moistureContinuous fields linear in time
4Thermal ID: prescribed, adiabatic, convection, custom inward heat fluxPrevious-value hold
5Moisture ID: prescribed, insulated, film, custom inward concentration fluxPrevious-value hold
6–7Thermal and moisture coefficient or signed custom fluxLinear in time

Theta time integration and coupling

Current Workbench implementation. The general theta equation below describes the theory family, not a selectable theta control in WB. The current transient Workbench solver uses backward Euler with a full-step/two-half-step error estimate. It stops at schedule changes and requested outputs; output spacing is not the integration accuracy target. Rejected trials do not commit temperature or reaction state. If the computation budget or supported schedule size is exceeded, the run fails explicitly rather than accepting a coarser result. Through-thickness mesh convergence, calibration and experimental validation must still be checked separately.

Linked thermal tables use the same property convention in Micro and Process: Micro reports the 23 °C reference, while Process evaluates the table at local temperature without extrapolation. Constituent-based through-thickness closure uses transverse fiber conductivity and matrix conductivity; a stored homogenized ply retains its own through-thickness conductivity.

Eq. 05.4.1-07Theta time integration
[C/Δt + θKn+1]Tn+1 = [C/Δt − (1−θ)Kn]Tn + Qn+θ
Equation detailsExplanation · variables · model connection · reference

Advances the matrix heat balance between old and new time levels. θ=1 is backward Euler; θ=0.5 is Crank–Nicolson. The source includes both interpolated boundaries and enabled reaction heat.

VariablesCdiagonal areal heat-capacity matrixJ/(m²·K)Kn, Kn+1old and new conduction-plus-boundary matricesW/(m²·K)Tn, Tn+1old and new nodal temperature vectorsKQn+θtheta-weighted surface and reaction source vectorW/m²θtime-integration parameterdimensionless, 0–1Δttransport time steps

Model connectionSolved repeatedly within each process step while kinetics and heat sources are updated. Convergence is checked using the largest normalized temperature or moisture change.

Theory basisImplicit theta-method discretization

Solver modes. Bypassing transport uses the prescribed temperature for each ply. A process-only study calculates the temperature field. A coupled study also maps the field into structural residual stress and progressive failure. Temperature inputs may be entered in kelvin or Celsius, but the internal kinetics evaluation always uses kelvin.

Theory references

  1. NASA, Composite Cure Process Modeling and Simulations using Finite Element Analysis (2016).
  2. NASA composite cure-process heat-transfer formulation and material-state coupling.
  3. CDS micromechanics theory: effective thermal conductivity, density, and heat capacity supplied to the ply transport cells.

Workbench availability: released models, inputs and compatible study paths. The wider theory library includes reference formulations not available in every Workbench solve.