04.12.3 / CDS Training Manual
Resolve a thick-panel
cure cycle and exotherm.
Use a published T700S/TC380 oven schedule to examine thermal lag, reaction heat, cure state, evolving modulus, and cycle optimization.
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∑ Selected models & submodels
These are the exercise’s linked choices, not solved results. Open a first-layer model to see its submodels and scope.
Kamal–Sourour autocatalytic · Kamal–Sourour Epoxy Cure
Reusable material model. It contributes only when assigned to a material used by this simulation; separate model records can supply independent properties.
Calibration & applicability
Illustrative model defaults — replace with characterized resin kinetics
CHILE (degree of cure) · CHILE cure-dependent modulus
Reusable material model. It contributes only when assigned to a material used by this simulation; separate model records can supply independent properties. Cure-dependent modulus does not automatically scale strength allowables.
Calibration & applicability
CHILE(α), section 2.4 of Materials 2019, 12, 259. Example parameters, not measured EP180 data. Fixed Poisson ratio; no viscoelastic relaxation or Tg softening. Incremental elastic stress integration at saved process intervals: check time-step convergence. Strength allowables are independent measured inputs, not scaled with modulus.
Temperature-dependent tabular · Temperature-dependent Thermal
Reusable material model. It contributes only when assigned to a material used by this simulation; separate model records can supply independent properties. Micro uses the 23 °C reference; Process evaluates the same table at local temperature, without extrapolation.
Calibration & applicability
Check source data, applicable environment and validity limits in the model record; saved defaults are not experimental validation.
1D Fickian diffusion · Layered Fickian Diffusion
Reusable material model. It contributes only when assigned to a material used by this simulation; separate model records can supply independent properties.
Calibration & applicability
Check source data, applicable environment and validity limits in the model record; saved defaults are not experimental validation.
Halpin–Tsai · T700 / EP180 UD
One compatible homogenization model per Micro recipe. Separate recipes compare models; their predictions are not blended.
∑ Theory & assumptions1D transient heat transfer · T700 Thermal Process · Thermal processing
Needs linked laminate properties and a compatible process schedule. A linked cycle is not a solved temperature history.
∑ Theory & assumptionsData travelling between blocks
Micro → Laminates
Predicted ply stiffness, strength, density and expansion properties.
Materials → Micro
Constituent stiffness, strength, density and thermal / moisture properties.
Models → Materials
Model choices and calibrated parameters.
Thermal → Simulation
SIMULATION selects this case and its analysis model; the case owns its applicable cycle and input references.
Laminates → Thermal
Ply angles and thicknesses, stiffness, mass and ply properties.
Simulation → Optimization
Linked inputs and current-property response for candidate evaluation.
Reference validation · 2026-09-18
Not benchmark validated
No matched quantitative reference comparison completed for the full exercise.
Recorded baseline only—not a certification of the current database, edited inputs, or every output. Analytical agreement is not experimental material or failure validation.
Source validation, comparisons and tested inputs
Execution: Completed (not validation)
The starter resin and cycle are not TC380 calibration. The source supplies the schedule and measured checkpoints, but not all kinetics, heat-of-reaction or transport inputs. Source those inputs before a quantitative comparison.
- NASA — Evaluation of Temperature Gradients During Cure of a Thick Carbon Fiber/Epoxy Composite ↗Source study identified; quantitative reproduction not established. TC380 kinetics, reaction heat, transport, boundary characterization and digitized measurements still required.
Tested inputs
Input SHA-256: bf765b769c16e22bd102d6e21b2eabccdfbb0052ff58ca608a19c3e6bd41f127
Solver source SHA-256: 30c8a614b6cb004a26da8adaf8ab7c534c37c4d534836921939f35a549e1bcc5
- One-dimensional through-thickness study, not oven airflow or a general 3D process model. Missing TC380 calibration remains a setup requirement, never a default validated result.
Download source-validation evidence (JSON) · Full 104-exercise study
Model a 40-ply, 25.4 mm T700S/TC380 panel through a two-stage oven cure and determine how core lag and cure exotherm change the process window.
CDS reproduces a one-dimensional through-thickness process study. The NASA experiment supplies the cycle and thermal checkpoints; separate qualified data are required for kinetics, reaction heat and transport.
Published basis
2 primary sourcesReports T700S/TC380 braided panels, the recommended two-stage cure cycle, embedded thermocouples, exotherm, and through-thickness conversion differences.
↗NASA Tech BriefsDesigning Cure Cycles for Matrix/Fiber Composite PartsDescribes two-stage ramp-and-hold cure-cycle design as an optimization problem rather than trial and error.
↗Starting data
Enter in the displayed units| Variable | Value | How it is used |
|---|---|---|
| Panel | 40 plies; 25.4 mm | Published 1 inch thick comparison case |
| Ramp 1 | Room temperature → 107°C at 1.1°C/min | First oven segment |
| Dwell 1 | 107°C for 60 min | Intermediate hold |
| Ramp 2 | 107°C → 180°C at 1.1°C/min | Second oven segment |
| Dwell 2 | 180°C for 120 min | High-temperature hold |
| Cool | ≤ 3°C/min to < 49°C | Controlled cooldown |
Review checkpoints
Comparison, not certification| Result | Published reference | Interpretation |
|---|---|---|
| 40-ply exotherm above commanded cure temperature | 18°F ≈ 10°C | Published measured overshoot for the 40-ply panel |
| Maximum through-thickness variation | ≤ 10°C | Reported across the tested thicknesses |
| At 180°C: center conversion | approximately 85% | Published estimate at onset of vitrification |
| At 170°C: tool-side conversion | approximately 68% | Demonstrates cure-state mismatch through thickness |
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Create the thick-panel baseline
Create a 40-ply T700S/TC380 laminate representing the 1 inch panel reported in the NASA thermal-gradient data.
- Use the linked TC380 cure-kinetics, reaction-heat and cure-dependent-modulus records when qualified inputs are available.
- Set total laminate thickness to 25.4 mm and assign through-thickness conductivity, density and specific heat from traceable records.
- Use enough through-thickness nodes to resolve the core and the two surfaces.
Enter the two-stage oven cycle
Build the published vacuum-bag-only schedule as a transient upper and lower boundary history.
- Start at the selected room reference temperature and ramp to 107°C at 1.1°C/min.
- Hold at 107°C for 60 minutes.
- Ramp to 180°C at 1.1°C/min and hold for 120 minutes.
- Cool at no more than 3°C/min until the part is below 49°C.
- Model the separate two-hour 180°C post-cure as a second cycle when it is included in the study.
Resolve thermal lag before adding reaction heat
Run the transient conduction model with cure exotherm disabled to establish the boundary-to-core lag.
- Plot oven or surface temperature with the core and tool-side node histories.
- Check the 107°C and 180°C transitions for adequate time resolution.
- Save the no-exotherm result as the conduction baseline.
Enable cure exotherm and evolving modulus
Turn on reaction heat and the cure-dependent modulus model, then rerun the same cycle.
- Compare peak core temperature, core-to-tool gradient and degree of cure with the baseline.
- Inspect when the core crosses the cure model’s gelation or vitrification transitions.
- Review the process-stress history only after the thermal and cure histories are credible.
Frame a process optimization
Duplicate the thermal case, including its own cycle, and optimize ramp or dwell variables against core-temperature and cure constraints.
- Choose a target core degree of cure and a maximum permitted core temperature or surface-to-core gradient.
- Allow the first ramp rate, intermediate dwell and second ramp rate to vary within manufacturing limits.
- Minimize cycle time subject to the thermal and cure constraints.
- Save the candidate snapshot, apply its cycle to the copied thermal case, and rerun the fully coupled case before comparing residual stress.
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