Define the input
Equipment, applied power or coil current, material data, duty and exposure.
Workflow / Welding
Heat the joint. Follow the bondline.
Connect microwave or induction heating to the thermal history, then examine what pressure and time do to contact and polymer healing.
One connected study
Heat reaches the joint. Pressure and time develop the bond.
Solve temperature
Deposit heat in the physical plies and conduct it through the stack.
Apply the bond models
Selected contact and healing laws use temperature and a separate pressure history.
Inspect the evidence
Compare power, temperature, contact and healing before choosing settings.
Conceptual connections. A thermal or bonding index is not a certified weld-strength result.
Four connected examples
Start with a heating route. Keep its assumptions in view.
These are editable teaching studies with illustrative material and calibration inputs. Their diagrams show the process route, not calculated fields or vendor hardware.
P.09.01 · E.03.90
Batch microwave core heating
PEI · explicit layered dielectric stack
Compare internal absorption and heat spreading through a stationary laminate.
Microwave layered absorption
Stationary stack · source window in time
- Absorbed, reflected and transmitted power
- Core and skin temperature histories
- Power density through every physical ply
Every ply needs explicit dielectric data. A selected core is a reporting region; losses in the skins remain in the energy balance.
P.09.02 · E.03.91
Moving microwave heating and bonding
CF/PEEK · calibrated microwave deposition
Follow a material point through heating and pressure, then inspect contact and polymer healing.
Microwave calibrated heating
Moving stack · exposure zone linked to case speed
- Resolved exposure time and target temperature
- Prescribed pressure and intimate contact
- Healing potential and coupled bonding
The moving model resolves time and thickness. It does not calculate a spatial microwave cavity or lateral thermal field.
P.10.01 · E.03.92
Induction bondline welding
CF/PEEK · calibrated bondline heat
Deposit calibrated power near the bondline and compare the resulting thermal and bonding histories.
Induction calibrated heating
Explicit heating window · separate pressure history
- Deposited power and local bondline temperature
- Heat conducted into both adjoining laminates
- Contact, healing and optional calibrated strength scaling
Coil dimensions document the setup. They do not predict induced currents, magnetic losses or deposited watts.
P.10.02 · E.03.93
Analytical coil heating and welding
AS4/PEEK · explicit thin-sheet conductivity
Move a finite four-ply patch through a prescribed-current coil field, then follow the central bondline.
Induction analytical coil heating
50 × 25 mm patch · circular four-turn coil
- RMS magnetic field and ideal/deposited Joule heat
- Target overlap and saved approximation checks
- Bondline temperature, contact and healing
Closed-loop conductivity and efficiency are illustrative inputs. The thermal response uses area-averaged heat; no lateral temperature or interply current network is solved.
Temperature is part of the story.
A hot bondline does not by itself establish a good weld. The selected contact model follows the area that touches under pressure. The healing model follows polymer interdiffusion while the interface is hot. Coupled bonding accounts for when each area first makes contact.
Use the same solved thermal history and the actual interface location when comparing these quantities. Heating does not apply mechanical pressure automatically.
Contact, healing and material-state models →Know what the source model supplies.
Layered microwave mode calculates absorption from explicit dielectric properties across the physical stack. Calibrated microwave and induction modes distribute supplied absorbed power over selected plies.
The thermal model resolves time and thickness. Analytical coil fields do not add lateral temperature, a loaded coil-circuit solution or certified joint strength. Refine the thermal mesh and exposure history, then compare against measurements for the intended process.
Heating inputs, equations and limits →